JPH026213B2 - - Google Patents
Info
- Publication number
- JPH026213B2 JPH026213B2 JP2755584A JP2755584A JPH026213B2 JP H026213 B2 JPH026213 B2 JP H026213B2 JP 2755584 A JP2755584 A JP 2755584A JP 2755584 A JP2755584 A JP 2755584A JP H026213 B2 JPH026213 B2 JP H026213B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electronic component
- recess
- insulating plate
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 239000011888 foil Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical group O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2755584A JPS60170930A (ja) | 1984-02-16 | 1984-02-16 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2755584A JPS60170930A (ja) | 1984-02-16 | 1984-02-16 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60170930A JPS60170930A (ja) | 1985-09-04 |
| JPH026213B2 true JPH026213B2 (en]) | 1990-02-08 |
Family
ID=12224297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2755584A Granted JPS60170930A (ja) | 1984-02-16 | 1984-02-16 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60170930A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4823942B2 (ja) * | 2007-02-23 | 2011-11-24 | ニチコン株式会社 | チップ形電子部品 |
-
1984
- 1984-02-16 JP JP2755584A patent/JPS60170930A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60170930A (ja) | 1985-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |